High temperature Au-based solder reliability in electronic packages for harsh environments
The operation of electronic packages in high temperature environments is a significant challenge for the microelectronics industry, and poses a challenge to the traditional temperature limit of 125°C for high electronic systems, such as those used in down-hole, well-logging and aero-engine applicati...
| Autores principales: | , , , |
|---|---|
| Formato: | Journal article |
| Lenguaje: | English |
| Publicado: |
2011
|