High temperature Au-based solder reliability in electronic packages for harsh environments
The operation of electronic packages in high temperature environments is a significant challenge for the microelectronics industry, and poses a challenge to the traditional temperature limit of 125°C for high electronic systems, such as those used in down-hole, well-logging and aero-engine applicati...
| Những tác giả chính: | , , , |
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| Định dạng: | Journal article |
| Ngôn ngữ: | English |
| Được phát hành: |
2011
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