High temperature Au-based solder reliability in electronic packages for harsh environments
The operation of electronic packages in high temperature environments is a significant challenge for the microelectronics industry, and poses a challenge to the traditional temperature limit of 125°C for high electronic systems, such as those used in down-hole, well-logging and aero-engine applicati...
| Hlavní autoři: | , , , |
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| Médium: | Journal article |
| Jazyk: | English |
| Vydáno: |
2011
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