Optimizing the performance of the Au-Si system for high temperature die attach applications
The operation of electronic packages under exceptionally harsh environments presents a significant challenge for the microelectronics industry, for example, in down-hole, well-logging and turbo-machinery applications. High temperature Au based solders are one potential candidate for die attachment f...
| Hoofdauteurs: | , , , |
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| Formaat: | Journal article |
| Taal: | English |
| Gepubliceerd in: |
2011
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