Application of high temperature electronics packaging technology to signal conditioning and processing circuits
The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibratio...
| Главные авторы: | , , , , , , , , , , |
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| Формат: | Journal article |
| Язык: | English |
| Опубликовано: |
2010
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