Riches, S., Cannon, K., Johnston, C., Sousa, M., Grant, P., Gulliver, J., . . . Firmstone, M. (2010). Application of high temperature electronics packaging technology to signal conditioning and processing circuits.
Chicagoスタイル(17版)引用形式Riches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.
MLA(9版)引用形式Riches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.
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