Dyfyniad APA

Riches, S., Cannon, K., Johnston, C., Sousa, M., Grant, P., Gulliver, J., . . . Firmstone, M. (2010). Application of high temperature electronics packaging technology to signal conditioning and processing circuits.

Dyfyniad Arddull Chicago

Riches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.

Dyfyniad MLA

Riches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.

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