Riches, S., Cannon, K., Johnston, C., Sousa, M., Grant, P., Gulliver, J., . . . Firmstone, M. (2010). Application of high temperature electronics packaging technology to signal conditioning and processing circuits.
Chicago-Zitierstil (17. Ausg.)Riches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.
MLA-Zitierstil (9. Ausg.)Riches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.