Riches, S., Cannon, K., Johnston, C., Sousa, M., Grant, P., Gulliver, J., . . . Firmstone, M. (2010). Application of high temperature electronics packaging technology to signal conditioning and processing circuits.
Chicago Style aipamenaRiches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.
MLA aipamenaRiches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.
Kontuz: berrikusi erreferentzia hauek erabili aurretik.