APA (7e ed.) Bronvermelding

Riches, S., Cannon, K., Johnston, C., Sousa, M., Grant, P., Gulliver, J., . . . Firmstone, M. (2010). Application of high temperature electronics packaging technology to signal conditioning and processing circuits.

Chicago (17e ed.) Bronvermelding

Riches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.

MLA (9e ed.) Bronvermelding

Riches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.