Riches, S., Cannon, K., Johnston, C., Sousa, M., Grant, P., Gulliver, J., . . . Firmstone, M. (2010). Application of high temperature electronics packaging technology to signal conditioning and processing circuits.
Chicago Style (17th ed.) CitationRiches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.
MLA引文Riches, S., et al. Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits. 2010.
警告：這些引文格式不一定是100％准確.