Application of high temperature electronics packaging technology to signal conditioning and processing circuits
The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibratio...
मुख्य लेखकों: | Riches, S, Cannon, K, Johnston, C, Sousa, M, Grant, P, Gulliver, J, Langley, M, Pittson, R, Serban, S, Baghurst, D, Firmstone, M |
---|---|
स्वरूप: | Journal article |
भाषा: | English |
प्रकाशित: |
2010
|
समान संसाधन
-
Assessment of the reliability of high temperature electronics packaging technology
द्वारा: Riches, S, और अन्य
प्रकाशित: (2008) -
Development of high temperature electronics packaging technology for long term operation at 250°C
द्वारा: Riches, S, और अन्य
प्रकाशित: (2009) -
High temperature endurance of packaged SOI devices for signal conditioning and processing applications
द्वारा: Riches, S, और अन्य
प्रकाशित: (2011) -
Assessing the reliability of die attach materials in electronic packages for high temperature applications
द्वारा: Sousa, M, और अन्य
प्रकाशित: (2010) -
High temperature Au-based solder reliability in electronic packages for harsh environments
द्वारा: Sousa, M, और अन्य
प्रकाशित: (2011)