Application of high temperature electronics packaging technology to signal conditioning and processing circuits

Application of high temperature electronics packaging technology to signal conditioning and processing circuits

The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibratio...

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Những tác giả chính:	Riches, S, Cannon, K, Johnston, C, Sousa, M, Grant, P, Gulliver, J, Langley, M, Pittson, R, Serban, S, Baghurst, D, Firmstone, M
Định dạng:	Journal article
Ngôn ngữ:	English
Được phát hành:	2010

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