Inhomogeneous strain release during bending of WS2 on flexible substrates

Inhomogeneous strain release during bending of WS2 on flexible substrates

Two-dimensional (2D) materials hold great promise in flexible electronics, but the weak van der Waals interlayer bonding may pose a problem during bending, where easy interlayer sliding can occur. Furthermore, thin films of rigid materials are often observed to delaminate from soft substrates during...

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Những tác giả chính:	Tweedie, M, Sheng, Y, Sarwat, S, Xu, W, Bhaskaran, H, Warner, J
Định dạng:	Journal article
Ngôn ngữ:	English
Được phát hành:	American Chemical Society 2018

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