Residual stress measurement in thin films using the semi-destructive ring-core drilling method using Focused Ion Beam

In the present study, residual stress evaluation in thin films was achieved using a semi-destructive trench-cutting method. Focused Ion Beam (FIB) was employed to introduce the strain relief by ring-core milling, i.e. creating a trench around an "island". Either SEM or FIB imaging can be u...

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Bibliographic Details
Main Authors: Song, X, Yeap, K, Zhu, J, Belnoue, J, Sebastiani, M, Bemporad, E, Zeng, K, Korsunsky, A
Format: Journal article
Language:English
Published: 2011