Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape
AFM and EBSD characterization has been carried out to measure the degree of grain boundary grooving in cube-textured Ni and Ni-10wt%Cr substrates. Low angle grain boundary grooves are found to be consistently shallower than grooves at high angle boundaries. Our results suggest that the recrystalliza...
| Main Authors: | , , , |
|---|---|
| Format: | Conference item |
| Published: |
2001
|