Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape
AFM and EBSD characterization has been carried out to measure the degree of grain boundary grooving in cube-textured Ni and Ni-10wt%Cr substrates. Low angle grain boundary grooves are found to be consistently shallower than grooves at high angle boundaries. Our results suggest that the recrystalliza...
| Main Authors: | , , , |
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| Format: | Conference item |
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2001
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| _version_ | 1797078499389865984 |
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| author | Gladstone, T Moore, J Wilkinson, A Grovenor, C |
| author_facet | Gladstone, T Moore, J Wilkinson, A Grovenor, C |
| author_sort | Gladstone, T |
| collection | OXFORD |
| description | AFM and EBSD characterization has been carried out to measure the degree of grain boundary grooving in cube-textured Ni and Ni-10wt%Cr substrates. Low angle grain boundary grooves are found to be consistently shallower than grooves at high angle boundaries. Our results suggest that the recrystallization of pure Ni substrates in a Ar-H, atmosphere rather than vacuum may be beneficial in minimizing groove depth. Grain boundary grooves in Ni-10wt%Cr tape were found to be deeper than in pure Ni, consistent with the higher temperature used for recrystallization. |
| first_indexed | 2024-03-07T00:32:44Z |
| format | Conference item |
| id | oxford-uuid:806129f7-ef3e-437f-9f83-482f29a5de7c |
| institution | University of Oxford |
| last_indexed | 2024-03-07T00:32:44Z |
| publishDate | 2001 |
| record_format | dspace |
| spelling | oxford-uuid:806129f7-ef3e-437f-9f83-482f29a5de7c2022-03-26T21:22:53ZGrain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tapeConference itemhttp://purl.org/coar/resource_type/c_5794uuid:806129f7-ef3e-437f-9f83-482f29a5de7cSymplectic Elements at Oxford2001Gladstone, TMoore, JWilkinson, AGrovenor, CAFM and EBSD characterization has been carried out to measure the degree of grain boundary grooving in cube-textured Ni and Ni-10wt%Cr substrates. Low angle grain boundary grooves are found to be consistently shallower than grooves at high angle boundaries. Our results suggest that the recrystallization of pure Ni substrates in a Ar-H, atmosphere rather than vacuum may be beneficial in minimizing groove depth. Grain boundary grooves in Ni-10wt%Cr tape were found to be deeper than in pure Ni, consistent with the higher temperature used for recrystallization. |
| spellingShingle | Gladstone, T Moore, J Wilkinson, A Grovenor, C Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape |
| title | Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape |
| title_full | Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape |
| title_fullStr | Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape |
| title_full_unstemmed | Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape |
| title_short | Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape |
| title_sort | grain boundary misorientation and thermal grooving in cube textured ni and ni cr tape |
| work_keys_str_mv | AT gladstonet grainboundarymisorientationandthermalgroovingincubetexturedniandnicrtape AT moorej grainboundarymisorientationandthermalgroovingincubetexturedniandnicrtape AT wilkinsona grainboundarymisorientationandthermalgroovingincubetexturedniandnicrtape AT grovenorc grainboundarymisorientationandthermalgroovingincubetexturedniandnicrtape |