Grain boundary misorientation and thermal grooving in cube-textured Ni and Ni-Cr tape
AFM and EBSD characterization has been carried out to measure the degree of grain boundary grooving in cube-textured Ni and Ni-10wt%Cr substrates. Low angle grain boundary grooves are found to be consistently shallower than grooves at high angle boundaries. Our results suggest that the recrystalliza...
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| Định dạng: | Conference item |
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2001
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