Si based multi-layered print circuit board for MEMS packaging fabricated by Si deep etching, bonding and metal powder injection
In this report, Silicon wafer based multi-layered print circuit board is presented. The developed stacked circuit board will lead to realization of 3 dimensional MEMS packaging.The through holes and trenches were formed by ICP Si deep etching and the stacked layered structure was prepared with Si fu...
| Main Authors: | , , , , , , |
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| Format: | Conference item |
| Published: |
2001
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