Nitrogen in silicon: Diffusion at 500-750 °C and interaction with dislocations

The results of dislocation unlocking experiments using nitrogen-doped float-zone silicon are reported. Dislocation unlocking stress is measured in specimens subjected to anneals for a range of durations and temperatures. Analysis of the rate of the initial rise in unlocking stress with annealing tim...

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Main Authors: Alpass, C, Murphy, J, Falster, R, Wilshaw, P
Format: Journal article
Language:English
Published: 2009
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author Alpass, C
Murphy, J
Falster, R
Wilshaw, P
author_facet Alpass, C
Murphy, J
Falster, R
Wilshaw, P
author_sort Alpass, C
collection OXFORD
description The results of dislocation unlocking experiments using nitrogen-doped float-zone silicon are reported. Dislocation unlocking stress is measured in specimens subjected to anneals for a range of durations and temperatures. Analysis of the rate of the initial rise in unlocking stress with annealing time gives an activation energy for nitrogen diffusion of 3.24 eV in the 500-750 °C temperature range. Numerical simulations of nitrogen diffusion to the dislocation core allow an approximate value of 200,000 cm2 s-1 to be estimated for the diffusivity pre-factor. These diffusion measurements are consistent with the results of higher temperature secondary ion mass spectrometry out-diffusion experiments in the literature. Other measurements made at up to 1050 °C followed by fast quenching indicate that nitrogen's ability to lock dislocations is substantially reduced at high temperatures. © 2008 Elsevier B.V. All rights reserved.
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spelling oxford-uuid:8ca4a00b-83f1-4a5e-90c9-c03aa44e0f4b2022-03-26T22:45:52ZNitrogen in silicon: Diffusion at 500-750 °C and interaction with dislocationsJournal articlehttp://purl.org/coar/resource_type/c_dcae04bcuuid:8ca4a00b-83f1-4a5e-90c9-c03aa44e0f4bEnglishSymplectic Elements at Oxford2009Alpass, CMurphy, JFalster, RWilshaw, PThe results of dislocation unlocking experiments using nitrogen-doped float-zone silicon are reported. Dislocation unlocking stress is measured in specimens subjected to anneals for a range of durations and temperatures. Analysis of the rate of the initial rise in unlocking stress with annealing time gives an activation energy for nitrogen diffusion of 3.24 eV in the 500-750 °C temperature range. Numerical simulations of nitrogen diffusion to the dislocation core allow an approximate value of 200,000 cm2 s-1 to be estimated for the diffusivity pre-factor. These diffusion measurements are consistent with the results of higher temperature secondary ion mass spectrometry out-diffusion experiments in the literature. Other measurements made at up to 1050 °C followed by fast quenching indicate that nitrogen's ability to lock dislocations is substantially reduced at high temperatures. © 2008 Elsevier B.V. All rights reserved.
spellingShingle Alpass, C
Murphy, J
Falster, R
Wilshaw, P
Nitrogen in silicon: Diffusion at 500-750 °C and interaction with dislocations
title Nitrogen in silicon: Diffusion at 500-750 °C and interaction with dislocations
title_full Nitrogen in silicon: Diffusion at 500-750 °C and interaction with dislocations
title_fullStr Nitrogen in silicon: Diffusion at 500-750 °C and interaction with dislocations
title_full_unstemmed Nitrogen in silicon: Diffusion at 500-750 °C and interaction with dislocations
title_short Nitrogen in silicon: Diffusion at 500-750 °C and interaction with dislocations
title_sort nitrogen in silicon diffusion at 500 750 °c and interaction with dislocations
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AT murphyj nitrogeninsilicondiffusionat500750candinteractionwithdislocations
AT falsterr nitrogeninsilicondiffusionat500750candinteractionwithdislocations
AT wilshawp nitrogeninsilicondiffusionat500750candinteractionwithdislocations