Realisation of high temperature electronics packaging technology for sensor conditioning and processing applications
The requirement to install electronic power and control systems in high temperature environments in aeroengines and in down-well exploration has posed a challenge to the traditional limit of 125°C of electronics systems. The leap in operating temperature to above 200°C in combination with high press...
| Main Authors: | , , |
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| Format: | Journal article |
| Language: | English |
| Published: |
2012
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