The development of an integrated fan and heat sink solution for thermal management in low profile applications

The increasing heat flux densities from portable electronics are leading to new methodologies being implemented to provide thermal management within such devices. Many technologies are under development to transport heat within electronic equipment to allow it to be transported into the surroundings...

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Bibliographic Details
Main Authors: Walsh, E, Grimes, R, ASME
Format: Journal article
Language:English
Published: 2006