Deep level impurity engineered semi-insulating Cz-silicon as microwave substrates

We show that deep level doping of Czochralski-grown silicon wafers is capable of providing high resistivity handle wafers suitable for radio frequency integrated circuits, in particular integrated passive devices (IPD) and 3D integration. Starting from n-type 50 Ωcm Czochralski silicon wafers, we us...

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Main Authors: Mallik, K, Abuelgasim, A, Ashburn, P, Groot, D, Wilshaw, P
Format: Conference item
Published: 2011
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author Mallik, K
Abuelgasim, A
Ashburn, P
Groot, D
Wilshaw, P
author_facet Mallik, K
Abuelgasim, A
Ashburn, P
Groot, D
Wilshaw, P
author_sort Mallik, K
collection OXFORD
description We show that deep level doping of Czochralski-grown silicon wafers is capable of providing high resistivity handle wafers suitable for radio frequency integrated circuits, in particular integrated passive devices (IPD) and 3D integration. Starting from n-type 50 Ωcm Czochralski silicon wafers, we use Au ion implantation and subsequent annealing to increase the resistivity of the wafers to over 10 k Ωcm at room temperatures in a controlled way. Coplanar waveguides fabricated on the implanted wafers show strongly reduced attenuation. Electromagnetic Simulations indicate that the quality factor of spiral inductors can be doubled if the high resistive layer is at least 100μm deep. © 2011 EUROPEAN MICROWAVE ASSOC.
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spelling oxford-uuid:a6200b40-c256-4ac0-b62c-c7fb773d3d862022-03-27T02:45:02ZDeep level impurity engineered semi-insulating Cz-silicon as microwave substratesConference itemhttp://purl.org/coar/resource_type/c_5794uuid:a6200b40-c256-4ac0-b62c-c7fb773d3d86Symplectic Elements at Oxford2011Mallik, KAbuelgasim, AAshburn, PGroot, DWilshaw, PWe show that deep level doping of Czochralski-grown silicon wafers is capable of providing high resistivity handle wafers suitable for radio frequency integrated circuits, in particular integrated passive devices (IPD) and 3D integration. Starting from n-type 50 Ωcm Czochralski silicon wafers, we use Au ion implantation and subsequent annealing to increase the resistivity of the wafers to over 10 k Ωcm at room temperatures in a controlled way. Coplanar waveguides fabricated on the implanted wafers show strongly reduced attenuation. Electromagnetic Simulations indicate that the quality factor of spiral inductors can be doubled if the high resistive layer is at least 100μm deep. © 2011 EUROPEAN MICROWAVE ASSOC.
spellingShingle Mallik, K
Abuelgasim, A
Ashburn, P
Groot, D
Wilshaw, P
Deep level impurity engineered semi-insulating Cz-silicon as microwave substrates
title Deep level impurity engineered semi-insulating Cz-silicon as microwave substrates
title_full Deep level impurity engineered semi-insulating Cz-silicon as microwave substrates
title_fullStr Deep level impurity engineered semi-insulating Cz-silicon as microwave substrates
title_full_unstemmed Deep level impurity engineered semi-insulating Cz-silicon as microwave substrates
title_short Deep level impurity engineered semi-insulating Cz-silicon as microwave substrates
title_sort deep level impurity engineered semi insulating cz silicon as microwave substrates
work_keys_str_mv AT mallikk deeplevelimpurityengineeredsemiinsulatingczsiliconasmicrowavesubstrates
AT abuelgasima deeplevelimpurityengineeredsemiinsulatingczsiliconasmicrowavesubstrates
AT ashburnp deeplevelimpurityengineeredsemiinsulatingczsiliconasmicrowavesubstrates
AT grootd deeplevelimpurityengineeredsemiinsulatingczsiliconasmicrowavesubstrates
AT wilshawp deeplevelimpurityengineeredsemiinsulatingczsiliconasmicrowavesubstrates