Scanning optical microscopy of semiconductor devices

<p>This thesis explores the interaction of light and semiconductors using a scanning optical microscope. A key advantage to this approach is its non-destructiveness. This is a critical factor in the assurance of semiconductor device reliability. This research investigates novel ways in which t...

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Bibliographic Details
Main Authors: McCabe, E, McCabe, Eithne
Other Authors: Wilson, T
Format: Thesis
Language:English
Published: 1987
Subjects:
_version_ 1826291104091209728
author McCabe, E
McCabe, Eithne
author2 Wilson, T
author_facet Wilson, T
McCabe, E
McCabe, Eithne
author_sort McCabe, E
collection OXFORD
description <p>This thesis explores the interaction of light and semiconductors using a scanning optical microscope. A key advantage to this approach is its non-destructiveness. This is a critical factor in the assurance of semiconductor device reliability. This research investigates novel ways in which the light beam of a scanning optical microscope may be used to detect defects in semiconductors. Attention is focused on the use of the optical beam induced current technique (OBIC). This method permits the imaging of defects in semiconductor devices which may affect the electrical performance of these devices.</p><p>For the first time a theory has been developed which forms the basis of an understanding of how excess minority carriers are distributed in a semiconductor when probed with a with a finely focused light beam. This theory is used to predict the resolution of device defects imaged using OBIC. This work is particularly important in that it may incorporate the exact light probe distribution in the semiconductor material which is calculated in this thesis.</p><p>A new method to display low contrast OBIC images has been used to highlight defects in semiconductor devices. In addition an exciting novel method to obtain spatial information on the distribution of defects at the silicon/silicon-dioxide interface in metal oxide semiconductor devices has been found. This method can examine many defects which cause serious problems for device manufacturers including the effect of radiation damage on device performance. Other non-destructive techniques which can complement OBIC imaging are explored including photoluminescence and infrared transmission imaging. Additional research is proposed for the future. This research in conjunction with the research in this thesis would allow a comprehensive and powerful examination approach of both static and dynamic conditions of semiconductor devices.</p>
first_indexed 2024-03-07T02:54:22Z
format Thesis
id oxford-uuid:aec769d9-5c8a-48d6-88fe-3a1632e0888d
institution University of Oxford
language English
last_indexed 2024-03-07T02:54:22Z
publishDate 1987
record_format dspace
spelling oxford-uuid:aec769d9-5c8a-48d6-88fe-3a1632e0888d2022-03-27T03:44:53ZScanning optical microscopy of semiconductor devicesThesishttp://purl.org/coar/resource_type/c_db06uuid:aec769d9-5c8a-48d6-88fe-3a1632e0888dOpticsMicroscopySemiconductorsEnglishPolonsky Theses Digitisation Project1987McCabe, EMcCabe, EithneWilson, TWilson, T<p>This thesis explores the interaction of light and semiconductors using a scanning optical microscope. A key advantage to this approach is its non-destructiveness. This is a critical factor in the assurance of semiconductor device reliability. This research investigates novel ways in which the light beam of a scanning optical microscope may be used to detect defects in semiconductors. Attention is focused on the use of the optical beam induced current technique (OBIC). This method permits the imaging of defects in semiconductor devices which may affect the electrical performance of these devices.</p><p>For the first time a theory has been developed which forms the basis of an understanding of how excess minority carriers are distributed in a semiconductor when probed with a with a finely focused light beam. This theory is used to predict the resolution of device defects imaged using OBIC. This work is particularly important in that it may incorporate the exact light probe distribution in the semiconductor material which is calculated in this thesis.</p><p>A new method to display low contrast OBIC images has been used to highlight defects in semiconductor devices. In addition an exciting novel method to obtain spatial information on the distribution of defects at the silicon/silicon-dioxide interface in metal oxide semiconductor devices has been found. This method can examine many defects which cause serious problems for device manufacturers including the effect of radiation damage on device performance. Other non-destructive techniques which can complement OBIC imaging are explored including photoluminescence and infrared transmission imaging. Additional research is proposed for the future. This research in conjunction with the research in this thesis would allow a comprehensive and powerful examination approach of both static and dynamic conditions of semiconductor devices.</p>
spellingShingle Optics
Microscopy
Semiconductors
McCabe, E
McCabe, Eithne
Scanning optical microscopy of semiconductor devices
title Scanning optical microscopy of semiconductor devices
title_full Scanning optical microscopy of semiconductor devices
title_fullStr Scanning optical microscopy of semiconductor devices
title_full_unstemmed Scanning optical microscopy of semiconductor devices
title_short Scanning optical microscopy of semiconductor devices
title_sort scanning optical microscopy of semiconductor devices
topic Optics
Microscopy
Semiconductors
work_keys_str_mv AT mccabee scanningopticalmicroscopyofsemiconductordevices
AT mccabeeithne scanningopticalmicroscopyofsemiconductordevices