GETTERING OF COPPER TO OXIDATION INDUCED STACKING-FAULTS IN SILICON

Results are presented from an investigation concerning the influence of oxidation-induced stacking faults, their bounding partial dislocations, and mechanically-induced surface pits on the precipitation behaviour of copper in silicon. Controlled amounts of copper are diffused into wafers containing...

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Bibliographic Details
Main Authors: Decoteau, M, Wilshaw, P, Falster, R
Format: Journal article
Language:English
Published: 1990