A comparative study of die attach strategies for use in harsh environments
<p>Well-logging and aerospace applications require electronics capable of withstanding elevated temperature operation. A key element of high temperature packaging technology is the Si die attach material, and a comparative study of two die attach systems for use in harsh environment has been p...
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| フォーマット: | 学位論文 |
| 言語: | English |
| 出版事項: |
2012
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