The processing, microstructure and creep properties of Pb-free solders for harsh environments

The processing, microstructure and creep properties of Pb-free solders for harsh environments

<p>The constitutive mechanical behaviour with a focus on creep of Sn-Pb and various Sn-Ag-Cu based Pb-free solders in the 25-150°C temperature range has been studied using nanoindentation and various new meso-scale tests. All alloys have been studied as bulk wave soldering bars, as-received so...

Полное описание

Библиографические подробности
Главный автор:	Godard Desmarest, S
Другие авторы:	Grant, P
Формат:	Диссертация
Язык:	English
Опубликовано:	2013
Предметы:	Materials Sciences Physical Sciences

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