The processing, microstructure and creep properties of Pb-free solders for harsh environments
<p>The constitutive mechanical behaviour with a focus on creep of Sn-Pb and various Sn-Ag-Cu based Pb-free solders in the 25-150°C temperature range has been studied using nanoindentation and various new meso-scale tests. All alloys have been studied as bulk wave soldering bars, as-received so...
Huvudupphovsman: | Godard Desmarest, S |
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Övriga upphovsmän: | Grant, P |
Materialtyp: | Lärdomsprov |
Språk: | English |
Publicerad: |
2013
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Ämnen: |
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