(S)TEM analysis of the interdiffusion and barrier layer formation in Mn/Cu heterostructures on SiO2 for interconnect technologies
Mn/Cu heterostructures thermally evaporated onto SiO 2 and subsequently annealed were investigated by transmission electron microscopy (TEM) related techniques in order to study the diffusion interactions which lead to barrier layer formation. Electron energy loss spectroscopy provide evidence for t...
| Main Authors: | , , , , , , |
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| Format: | Journal article |
| Language: | English |
| Published: |
2012
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