APA (7th ed.) Citation

Lozano, J., Lozano-Perez, S., Bogan, J., Wang, Y., Brennan, B., Nellist, P., & Hughes, G. (2012). (S)TEM analysis of the interdiffusion and barrier layer formation in Mn/Cu heterostructures on SiO2 for interconnect technologies.

Chicago Style (17th ed.) Citation

Lozano, J., S. Lozano-Perez, J. Bogan, Y. Wang, B. Brennan, P. Nellist, and G. Hughes. (S)TEM Analysis of the Interdiffusion and Barrier Layer Formation in Mn/Cu Heterostructures on SiO2 for Interconnect Technologies. 2012.

MLA (9th ed.) Citation

Lozano, J., et al. (S)TEM Analysis of the Interdiffusion and Barrier Layer Formation in Mn/Cu Heterostructures on SiO2 for Interconnect Technologies. 2012.