(S)TEM analysis of the interdiffusion and barrier layer formation in Mn/Cu heterostructures on SiO2 for interconnect technologies

(S)TEM analysis of the interdiffusion and barrier layer formation in Mn/Cu heterostructures on SiO2 for interconnect technologies

Mn/Cu heterostructures thermally evaporated onto SiO 2 and subsequently annealed were investigated by transmission electron microscopy (TEM) related techniques in order to study the diffusion interactions which lead to barrier layer formation. Electron energy loss spectroscopy provide evidence for t...

Bibliográfalaš dieđut
Váldodahkkit:	Lozano, J, Lozano-Perez, S, Bogan, J, Wang, Y, Brennan, B, Nellist, P, Hughes, G
Materiálatiipa:	Journal article
Giella:	English
Almmustuhtton:	2012

Geahča maid

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