Microstructural characterisation of spray formed Si-30Al for thermal management applications
This paper presents a study of the microstructure of a spray formed Si-30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of ~5μ equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of ~10 μm equiaxed Al-rich grains interpenetrati...
| 主要な著者: | , , , |
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| フォーマット: | Journal article |
| 言語: | English |
| 出版事項: |
Elsevier
2006
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| 主題: |
| 要約: | This paper presents a study of the microstructure of a spray formed Si-30 wt.%Al alloy used in electronic packaging applications. The microstructure consisted of ~5μ equiaxed primary Si grains and a coarse grained Al-rich phase with occasional regions of ~10 μm equiaxed Al-rich grains interpenetrating the Si network with no evidence of a lamellar Al-Si eutectic. This unusual microstructure arose because of the particular solidification conditions during and immediately after the spray forming process and the large alloy freezing range. |
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