Studies of the chemistry of plasmas used for semiconductor etching

Studies of the chemistry of plasmas used for semiconductor etching

<p>Optical diagnostic techniques have been developed and then used to investigate the chemistry of reactive species formed in CF<sub>4</sub> / O<sub>2</sub> rf parallel plate discharges, similar to those employed in semiconductor material processing.</p> <p>...

Disgrifiad llawn

Manylion Llyfryddiaeth
Prif Awduron:	Toogood, M, M. J. Toogood
Awduron Eraill:	Hancock, G
Fformat:	Traethawd Ymchwil
Iaith:	English
Cyhoeddwyd:	1991
Pynciau:	Semiconductors Etching Plasma etching

Eitemau Tebyg

Plasma etching in semiconductor fabrication /
gan: 217469 Morgan, Russ A.
Cyhoeddwyd: (1985)

Plasma processes for semiconductor fabrication /
gan: 414824 Hitchon, W. Nicholas G.
Cyhoeddwyd: (1999)

Studies on etching and polymer deposition in halocarbon plasmas
gan: Astell-Burt, P, et al.
Cyhoeddwyd: (1987)

Handbook of plasma processing technology : fundamentals, etching, deposition, and surface interactions /
gan: Rossnagel, Stephen M., et al.
Cyhoeddwyd: (1990)

Plasma technology in wool /
gan: Kan, C. W., et al.
Cyhoeddwyd: (2007)

Dry etching for VLSI /
gan: 198063 Roosmalen, A. J. Van, et al.
Cyhoeddwyd: (1991)

Etching performance of silicon wafers with redesigned etching drum : An Approach to Etching Optimization /
gan: Rozzeta Dolah, author, et al.
Cyhoeddwyd: (2012)

Etching performance of silicon wafers with redesigned etching drum /
gan: 186505 Rozzeta Dolah, et al.
Cyhoeddwyd: (2006)

Factor Design for the Oxide Etching Process to Reduce Edge Particle Contamination in Capacitively Coupled Plasma Etching Equipment
gan: Ching-Ming Ku, et al.
Cyhoeddwyd: (2022-06-01)

End point prediction in wet etching, cleaning, and rinsing of microstructures in semiconductor manufacturing
gan: Calliandra Stuffle, et al.
Cyhoeddwyd: (2022-08-01)

The versatile technique of RF plasma etching : the etch profile /
gan: 427692 Jacob, Adir

RF reactor with asymmetrical electrodes for reactive ion etching of semiconductors
gan: Dudin S. V., et al.
Cyhoeddwyd: (2011-04-01)

Etching performance of silicon wafers with redesigned etching drum [electronic resource] /
gan: 186505 Rozzeta Dolah, et al.
Cyhoeddwyd: (2006)

Formation of Black Silicon in a Process of Plasma Etching with Passivation in a SF<sub>6</sub>/O<sub>2</sub> Gas Mixture
gan: Andrey Miakonkikh, et al.
Cyhoeddwyd: (2024-05-01)

Applications of plasma processes to VLSI technology/
gan: Sugano, Takuo
Cyhoeddwyd: (1985)

Formation Mechanism of Rounded SiGe-Etch Front in Isotropic SiGe Plasma Etching for Gate-All-Around FETs
gan: Yu Zhao, et al.
Cyhoeddwyd: (2021-01-01)

The versatile technique of Rf plasma etching : mechanistic considerations for selective etching /
gan: 427692 Jacob, Adir

Digital Etching of Molybdenum Interconnects Using Plasma Oxidation
gan: Ivan Erofeev, et al.
Cyhoeddwyd: (2025-01-01)

Etching /
gan: 375081 Edmondson, Leonard
Cyhoeddwyd: (1973)

Doped or Quantum-Dot Layers as In Situ Etch-Stop Indicators for III/V Semiconductor Reactive Ion Etching (RIE) Using Reflectance Anisotropy Spectroscopy (RAS)
gan: Guilherme Sombrio, et al.
Cyhoeddwyd: (2021-04-01)

Effect of Plasma Etching Depth on Subsurface Defects in Quartz Crystal Elements
gan: Qingzhi Li, et al.
Cyhoeddwyd: (2023-10-01)

Characterization of an Etch Profile at a Wafer Edge in Capacitively Coupled Plasma
gan: Inho Seong, et al.
Cyhoeddwyd: (2022-11-01)

Plasma etching for fabrication of complex nanophotonic lasers from bonded InP semiconductor layers
gan: Jakub Dranczewski, et al.
Cyhoeddwyd: (2023-06-01)

Microstructural characterization and inductively coupled plasma-reactive ion etching resistance of Y2O3–Y4Al2O9 composite under CF4/Ar/O2 mixed gas conditions
gan: Ho Jin Ma, et al.
Cyhoeddwyd: (2024-03-01)

STUDY ABOUT ALUMINIUM ETCHING
gan: Botis Mihaela
Cyhoeddwyd: (2019-03-01)

RESEARCH PROCESS PLASMA ETCHING SIO2 MEMBRANE
gan: T. A. Ismailov, et al.
Cyhoeddwyd: (2016-07-01)

The versatile technique of RF plasma etching : kinetics of etchant formation /
gan: 427692 Jacob, Adir

The Method of Low-Temperature ICP Etching of InP/InGaAsP Heterostructures in Cl<sub>2</sub>-Based Plasma for Integrated Optics Applications
gan: Sergey Ishutkin, et al.
Cyhoeddwyd: (2021-12-01)

Plasma etching and surface characteristics depending on the crystallinity of the BaTiO3 thin film
gan: Han Byeol Lee, et al.
Cyhoeddwyd: (2023-01-01)

Investigation into SiO<sub>2</sub> Etching Characteristics Using Fluorocarbon Capacitively Coupled Plasmas: Etching with Radical/Ion Flux-Controlled
gan: Won-nyoung Jeong, et al.
Cyhoeddwyd: (2022-12-01)

Surface temper etch inspection after grinding
gan: 11585 American National Standards Institute, et al.

Study of Atmospheric Pressure Plasma Temperature Based on Silicon Carbide Etching
gan: Shaozhen Xu, et al.
Cyhoeddwyd: (2023-05-01)

Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
gan: Michael Huff
Cyhoeddwyd: (2021-08-01)

Manipulation of the Superhydrophobicity of Plasma-Etched Polymer Nanostructures
gan: Ke Du, et al.
Cyhoeddwyd: (2018-06-01)

Novel transparent high-entropy sesquioxide ceramics with high physicochemical plasma etching resistance
gan: Yu-Bin Shin, et al.
Cyhoeddwyd: (2025-01-01)

Variation of Bulk Etch Rate and some other Etching Parameters with Etching Temperature for Cellulose Nitrate LR-115 Detector
gan: Ali Hussain
Cyhoeddwyd: (2009-09-01)

A review of the mechanism and optimization of metal-assisted chemical etching and applications in semiconductors
gan: Kibum Jung, et al.
Cyhoeddwyd: (2024-12-01)

Redeposition-free inductively-coupled plasma etching of lithium niobate for integrated photonics
gan: Kaufmann Fabian, et al.
Cyhoeddwyd: (2023-01-01)

EVALUATION OF THE ADHESIVE INTERFACE BETWEEN ENAMEL AND A SINGLE-COMPONENT ADHESIVE APPLIED IN SELF-ETCHING AND SELECTIVE-ETCHING PROCEDURES
gan: Gianina Iovan, et al.
Cyhoeddwyd: (2014-07-01)

Selective Plasma Etching of Polymeric Substrates for Advanced Applications
gan: Harinarayanan Puliyalil, et al.
Cyhoeddwyd: (2016-06-01)