Nanoindentation of lead free solders for harsh environments
To better understand the factors governing the reliability of lead free solders during severe excursions in temperature, the hardness and elastic modulus of the micro-phases formed in a Sn-Ag-Cu/Cu solder joint were characterized using nanoindentation at temperatures from 25 to 175°C. The creep beha...
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| Format: | Conference item |
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2008
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