Determination of the creep properties of Pb-free solders for harsh environments using meso-scale testing
Solder joints in electronic packages are prone to failure due to the evolution of thermal expansion mismatch strains during thermal cycling. The comparatively wide operating temperature range and long lifetimes of aerospace electronics require high reliability solder joints. Since 2006, high reliabi...
| मुख्य लेखकों: | , , |
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| स्वरूप: | Conference item |
| भाषा: | English |
| प्रकाशित: |
IMAPS - International Microelectronics Assembly and Packaging Society
2012
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