Determination of the creep properties of Pb-free solders for harsh environments using meso-scale testing

Solder joints in electronic packages are prone to failure due to the evolution of thermal expansion mismatch strains during thermal cycling. The comparatively wide operating temperature range and long lifetimes of aerospace electronics require high reliability solder joints. Since 2006, high reliabi...

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Detalhes bibliográficos
Main Authors: Godard Desmarest, S, Johnston, C, Grant, PS
Formato: Conference item
Idioma:English
Publicado em: IMAPS - International Microelectronics Assembly and Packaging Society 2012