Understanding die attach materials performance in electronic packages under harsh environments
The operation of electronic packages under increasingly harsh environments is a significant challenge for the microelectronics industry. The generally accepted microelectronic temperature limit is 125°C but there is a strong push to extend this up to temperatures as high as 250°C in down-hole and tu...
| Main Authors: | , , , |
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| Format: | Journal article |
| Language: | English |
| Published: |
2010
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