Investigations on Zn-Al-Ge alloys as high temperature die attach material
Zn-Al based alloys have been suggested as high temperature lead-free solder for Si die attach by different researchers. But, so far, these alloys have not been tested in the industrial environment. In this study, Zn-Al-Ge alloy solder wire was used for Si die attachment on Cu substrate in an automat...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/11330/1/p0137.pdf |