Development of insulated cu wire stitch bonding
The market demands for higher pin counts and more chips functionality poses challenges in conventional wire bonding. However, the novel insulated Cu wire technology enables fine and ultra fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. This paper...
| প্রধান লেখক: | , , , , , |
|---|---|
| বিন্যাস: | Conference or Workshop Item |
| ভাষা: | English |
| প্রকাশিত: |
2013
|
| বিষয়গুলি: | |
| অনলাইন ব্যবহার করুন: | http://eprints.um.edu.my/15601/1/0001.pdf |