Development of insulated cu wire stitch bonding
The market demands for higher pin counts and more chips functionality poses challenges in conventional wire bonding. However, the novel insulated Cu wire technology enables fine and ultra fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. This paper...
| Main Authors: | , , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/15601/1/0001.pdf |