Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate
The aims of this research are to investigate the effects of Ni on the physical properties of Sn58Bi-xNi lead-free solder, and to examine its interfacial reaction with the copper substrate. In the experiments, four concentrations of Ni (i.e. 0.05, 0.1, 0.5 and 1.0 wt.%) were individually added into S...
| Main Authors: | , |
|---|---|
| Format: | Article |
| Published: |
Elsevier
2015
|
| Subjects: |