Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate

Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate

The aims of this research are to investigate the effects of Ni on the physical properties of Sn58Bi-xNi lead-free solder, and to examine its interfacial reaction with the copper substrate. In the experiments, four concentrations of Ni (i.e. 0.05, 0.1, 0.5 and 1.0 wt.%) were individually added into S...

Detaylı Bibliyografya
Asıl Yazarlar:	Kanlayasiri, Kannachai, Ariga, Tadashi
Materyal Türü:	Makale
Baskı/Yayın Bilgisi:	Elsevier 2015
Konular:	Q Science (General)

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