Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
Miniaturization of electronic devices has led to the development of 3D IC packages which require ultra-small-scale interconnections. Such small interconnects can be completely converted into Cu-Sn based intermetallic compounds (IMCs) after reflow. In an effort to improve IMC based interconnects, an...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI
2016
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/17437/1/HaseebASMA_%282016%29.pdf |