Effect of aluminum addition on the electrochemical corrosion behavior of Sn–3Ag–0.5Cu solder alloy in 3.5 wt% NaCl solution
The ternary eutectic Sn–Ag–Cu (SAC) solder alloys has become the most promising Pb-containing solders for the application in electronic packaging. The effect of Aluminum on the electrochemical corrosion behavior of Sn–3.0Ag–0.5Cu (SAC 305) solder alloy was investigated in 3.5 wt% NaCl solution in te...
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Springer Verlag (Germany)
2016
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