Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints
This work utilizes the lap shear test to investigate the shear strength and fracture behaviour of electroplated and reflowed Sn–Bi/Cu lead-free solder joints. Particular emphasis is given on the effects of reflow temperature on the interrelationships among the interfacial intermetallic compound (IMC...
Main Authors: | , , , |
---|---|
Format: | Article |
Published: |
Kluwer (now part of Springer)
2015
|
Subjects: |