APA (7th ed.) Citation

Goh, Y., Haseeb, A. M. A., Liew, H., & Sabri, M. (2015). Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints. Kluwer (now part of Springer).

Chicago Style (17th ed.) Citation

Goh, Y., A.S. Md. Abdul Haseeb, H.L Liew, and M.F.M Sabri. Deformation and Fracture Behaviour of Electroplated Sn–Bi/Cu Solder Joints. Kluwer (now part of Springer), 2015.

MLA (9th ed.) Citation

Goh, Y., et al. Deformation and Fracture Behaviour of Electroplated Sn–Bi/Cu Solder Joints. Kluwer (now part of Springer), 2015.