Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints
This work utilizes the lap shear test to investigate the shear strength and fracture behaviour of electroplated and reflowed Sn–Bi/Cu lead-free solder joints. Particular emphasis is given on the effects of reflow temperature on the interrelationships among the interfacial intermetallic compound (IMC...
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| Format: | Article |
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Kluwer (now part of Springer)
2015
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