Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints
Cu/SAC305/Cu solder joints were fabricated at ambient atmosphere using high-power-low-frequency ultrasonic vibration (USV) assisted hot plate reflow soldering. The influences of USV time (within 6 s) on the microstructure, hardness, yield strength and shear strength of the solder joints were investi...
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Elsevier
2016
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