Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints
Cu/SAC305/Cu solder joints were fabricated at ambient atmosphere using high-power-low-frequency ultrasonic vibration (USV) assisted hot plate reflow soldering. The influences of USV time (within 6 s) on the microstructure, hardness, yield strength and shear strength of the solder joints were investi...
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| Format: | Article |
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Elsevier
2016
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| author | Tan, A.T. Tan, A.W. Yusof, F. |
| author_facet | Tan, A.T. Tan, A.W. Yusof, F. |
| author_sort | Tan, A.T. |
| collection | UM |
| description | Cu/SAC305/Cu solder joints were fabricated at ambient atmosphere using high-power-low-frequency ultrasonic vibration (USV) assisted hot plate reflow soldering. The influences of USV time (within 6 s) on the microstructure, hardness, yield strength and shear strength of the solder joints were investigated. Refinement on the solder matrix microstructure, formation of thinner interfacial Cu6Sn5 IMC layer, and enhancement on the hardness, yield strength and shear strength were observed in all the ultrasonic-treated solder joints. Marked morphological change on the β-Sn phase was observed in the joint solder matrix when the USV time was increased from 1 s to 6 s. Thicker interfacial Cu6Sn5 IMC layer was observed at the top and bottom substrate/solder interfaces and the difference in thickness between these interfaces was greater at increased USV time. The solder matrix hardness increased with increasing USV time, indicating a reduction in joint ductility. The USV time has no influence on the joint shear strength, but decreased joint yield strength was observed after 1 s of USV time. The influences of the USV time on the solder joint properties were contributed by the combined effects of acoustic cavitation and streaming induced by the USV in the molten solder during reflow soldering. |
| first_indexed | 2024-03-06T05:43:20Z |
| format | Article |
| id | um.eprints-17717 |
| institution | Universiti Malaya |
| last_indexed | 2024-03-06T05:43:20Z |
| publishDate | 2016 |
| publisher | Elsevier |
| record_format | dspace |
| spelling | um.eprints-177172017-08-24T09:32:06Z http://eprints.um.edu.my/17717/ Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints Tan, A.T. Tan, A.W. Yusof, F. TJ Mechanical engineering and machinery Cu/SAC305/Cu solder joints were fabricated at ambient atmosphere using high-power-low-frequency ultrasonic vibration (USV) assisted hot plate reflow soldering. The influences of USV time (within 6 s) on the microstructure, hardness, yield strength and shear strength of the solder joints were investigated. Refinement on the solder matrix microstructure, formation of thinner interfacial Cu6Sn5 IMC layer, and enhancement on the hardness, yield strength and shear strength were observed in all the ultrasonic-treated solder joints. Marked morphological change on the β-Sn phase was observed in the joint solder matrix when the USV time was increased from 1 s to 6 s. Thicker interfacial Cu6Sn5 IMC layer was observed at the top and bottom substrate/solder interfaces and the difference in thickness between these interfaces was greater at increased USV time. The solder matrix hardness increased with increasing USV time, indicating a reduction in joint ductility. The USV time has no influence on the joint shear strength, but decreased joint yield strength was observed after 1 s of USV time. The influences of the USV time on the solder joint properties were contributed by the combined effects of acoustic cavitation and streaming induced by the USV in the molten solder during reflow soldering. Elsevier 2016 Article PeerReviewed Tan, A.T. and Tan, A.W. and Yusof, F. (2016) Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints. Journal of Materials Processing Technology, 238. pp. 8-14. ISSN 0924-0136, DOI https://doi.org/10.1016/j.jmatprotec.2016.06.036 <https://doi.org/10.1016/j.jmatprotec.2016.06.036>. http://dx.doi.org/10.1016/j.jmatprotec.2016.06.036 doi:10.1016/j.jmatprotec.2016.06.036 |
| spellingShingle | TJ Mechanical engineering and machinery Tan, A.T. Tan, A.W. Yusof, F. Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints |
| title | Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints |
| title_full | Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints |
| title_fullStr | Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints |
| title_full_unstemmed | Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints |
| title_short | Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints |
| title_sort | influence of high power low frequency ultrasonic vibration time on the microstructure and mechanical properties of lead free solder joints |
| topic | TJ Mechanical engineering and machinery |
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