Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability
The effect of using different flux on wettability of Sn-Ag-Cu lead free solder were investigated. In this study, solder paste Sn-3.0Ag-0.5Cu (SAC305) was used by introducing two types of no-clean flux with different ingredients. The solders namely as SAC305-A and SAC305-B respectively. Then, the bot...
| প্রধান লেখক: | , , , , , , |
|---|---|
| বিন্যাস: | প্রবন্ধ |
| প্রকাশিত: |
Springer
2018
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| বিষয়গুলি: |