Performances and procedures modules in micro electro mechanical system packaging technologies
This paper presents the challenging issues in micro electro mechanical system (MEMS) packing technologies. The MEMS package includes a MEMS device and a signal conditioning electronic circuit. In one viewpoint, MEMS application is categorized by the type of sensor, actuator, and structure. MEMS tech...
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| Format: | Article |
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Elsevier
2018
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