Performances and procedures modules in micro electro mechanical system packaging technologies
This paper presents the challenging issues in micro electro mechanical system (MEMS) packing technologies. The MEMS package includes a MEMS device and a signal conditioning electronic circuit. In one viewpoint, MEMS application is categorized by the type of sensor, actuator, and structure. MEMS tech...
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| Format: | Article |
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Elsevier
2018
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| author | Amiri, Iraj Sadegh Ariannejad, Mohammad Mahdi Vigneswaran, Dhasarathan Lim, Chin Seong Yupapin, Preecha Promphan |
| author_facet | Amiri, Iraj Sadegh Ariannejad, Mohammad Mahdi Vigneswaran, Dhasarathan Lim, Chin Seong Yupapin, Preecha Promphan |
| author_sort | Amiri, Iraj Sadegh |
| collection | UM |
| description | This paper presents the challenging issues in micro electro mechanical system (MEMS) packing technologies. The MEMS package includes a MEMS device and a signal conditioning electronic circuit. In one viewpoint, MEMS application is categorized by the type of sensor, actuator, and structure. MEMS technology applications in general domains are automotive, consumer, industrial, biotechnology and commercial applications. Few methods such as the low power oven, vacuum, and silicon glass packages were discussed. The major technique as die level and wafer level of packing including thin-film packing were reviewed in this paper. The problem of several failure mechanisms and challenges and their solutions were discussed in this review. |
| first_indexed | 2024-03-06T05:57:08Z |
| format | Article |
| id | um.eprints-22495 |
| institution | Universiti Malaya |
| last_indexed | 2024-03-06T05:57:08Z |
| publishDate | 2018 |
| publisher | Elsevier |
| record_format | dspace |
| spelling | um.eprints-224952019-09-23T07:45:32Z http://eprints.um.edu.my/22495/ Performances and procedures modules in micro electro mechanical system packaging technologies Amiri, Iraj Sadegh Ariannejad, Mohammad Mahdi Vigneswaran, Dhasarathan Lim, Chin Seong Yupapin, Preecha Promphan QC Physics TJ Mechanical engineering and machinery TK Electrical engineering. Electronics Nuclear engineering This paper presents the challenging issues in micro electro mechanical system (MEMS) packing technologies. The MEMS package includes a MEMS device and a signal conditioning electronic circuit. In one viewpoint, MEMS application is categorized by the type of sensor, actuator, and structure. MEMS technology applications in general domains are automotive, consumer, industrial, biotechnology and commercial applications. Few methods such as the low power oven, vacuum, and silicon glass packages were discussed. The major technique as die level and wafer level of packing including thin-film packing were reviewed in this paper. The problem of several failure mechanisms and challenges and their solutions were discussed in this review. Elsevier 2018 Article PeerReviewed Amiri, Iraj Sadegh and Ariannejad, Mohammad Mahdi and Vigneswaran, Dhasarathan and Lim, Chin Seong and Yupapin, Preecha Promphan (2018) Performances and procedures modules in micro electro mechanical system packaging technologies. Results in Physics, 11. pp. 306-314. ISSN 2211-3797, DOI https://doi.org/10.1016/j.rinp.2018.09.008 <https://doi.org/10.1016/j.rinp.2018.09.008>. https://doi.org/10.1016/j.rinp.2018.09.008 doi:10.1016/j.rinp.2018.09.008 |
| spellingShingle | QC Physics TJ Mechanical engineering and machinery TK Electrical engineering. Electronics Nuclear engineering Amiri, Iraj Sadegh Ariannejad, Mohammad Mahdi Vigneswaran, Dhasarathan Lim, Chin Seong Yupapin, Preecha Promphan Performances and procedures modules in micro electro mechanical system packaging technologies |
| title | Performances and procedures modules in micro electro mechanical system packaging technologies |
| title_full | Performances and procedures modules in micro electro mechanical system packaging technologies |
| title_fullStr | Performances and procedures modules in micro electro mechanical system packaging technologies |
| title_full_unstemmed | Performances and procedures modules in micro electro mechanical system packaging technologies |
| title_short | Performances and procedures modules in micro electro mechanical system packaging technologies |
| title_sort | performances and procedures modules in micro electro mechanical system packaging technologies |
| topic | QC Physics TJ Mechanical engineering and machinery TK Electrical engineering. Electronics Nuclear engineering |
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