Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment
In this work, the iron (Fe) and bismuth (Bi) added (0.05 wt% Fe and 1 wt% or 2 wt% Bi) Sn-1Ag-0.5Cu (SAC105) lead-free solder alloys were prepared and their microstructure and tensile properties under severe thermal environments were extensively investigated and compared with the base alloy SAC105....
| Main Authors: | , , , , , |
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| Format: | Article |
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Elsevier
2018
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